用户工具

站点工具


famousfab:start

MEMS产业机构

  • 中科院化学所本原纳米仪器公司 - 公司成立于1989年,是我国第一家专业从事扫描探针显微镜的研究、开发、生产、销售及服务的企业。
  • 杭州微微纳米技术有限公司 - 成立于1999年9月,注册资金700万元,主要从事于纳米材料制备、纳米材料应用和纳米技术开发研究。
  • 南京海泰纳米材料有限公司 - 是一家专门从事纳米技术的研究、生产和应用的高新技术企业,是国内最大的纳米氧化物系列产品生产基地之一;公司主要品种有纳米氧化硅、纳米氧化镁、纳米氧化钛、纳米氧化锌、纳米氧化铝、纳米氧化锆、纳米氧化镍、纳米氧化钴、纳米复合材料以及纳米抗菌和紫外屏蔽材料,导电材料等。 
  • Applied Microengineering Ltd - AML is an Independent, Industrial Commercial organization, dedicated to Microengineering. Microengineering, sometimes referred to as Micromachining, Microsystems (MST), MicroElectroMechanical Systems (MEMS) is defined by AML as a technology using Silicon wafers, as the unit of production and base material, processed by a variety of microelectronic (and other) wafer, batch, techniques to produce identical millimeter sized devices with micron sized features, accurately and at low cost. AML's mission is to help Industry exploit Microengineering. This is achieved via the design, development, productionisation and manufacture of microengineered products (currently mainly sensors) on behalf of industry.
  • C2V Concept To Volume - Provides Odin, a fully parametric mask editor dedicated to the MEMS design process. A library of elements is included and provides many standard elements such as straight and curved comb drives, several springs, microTAS elements etc. Import and export of masks in different formats is supported
  • Coventor Inc.(formerly Microcosm) - Provides fully integrated Computer Aided Design and Analysis tools for MEMS design, system simulation, manufacturing analysis, and packaging
  • Design Workshop Technologies - Develops and sells computer aided design physical layout and verification software used by organizations performing physical design (layout) and verification of MEMS circuits
  • ECSI - Manufactures benchtop, 2.5' x 2.5' x 2.5', 2 Gal, electroplaters specifically designed for MEMS and high density interconnects
  • Filmetrics, Inc. - Makers of film thickness measurement equipment for measuring silicon and other MEMS process films. All equipment is based on non-contact spectral reflectance. Silicon layers as thick as 160 microns can be measured
  • Heidelberg Instruments - Designs, develops and manufactures high precision Direct Write Laser instruments using raster scan technology to image on various substrates such as silicon, glass, film, or other photosensitive type plates. It can be used for semiconductor masks and direct writing, integrated optics, lead frames, flat panel displays, shadow mask, MEMS, and any application where high precision, high-resolution images must be produced
  • IntelliSense Software - IntelliSense Software Corporation is the leading supplier of CAD tools for MEMS. Its IntelliSuite family of CAD for MEMS is used by corporations worldwide. With customers in 17 countries on three continents, and partnerships with dozens of leading MEMS research institutes worldwide, IntelliSense Software is the leading innovator in MEMS design and development. In addition, IntelliSense Software provides design and consulting services for MEMS
  • MEM Research - Offers EM3DS, a full-wave simulation tool, fully 3D yet tailored for quasi-planar structures, suitable for EM analysis of MEMS, in particular MEMS switches. It uses a new MoM-based approach (Generalized Transverse Resonance-Diffraction GTRD), claimed to avoid the aspect-ratio limits of finite elements techniques. 60-day trial version free for download, as well as a completely free (but functionally limited) version
  • MEMSCAP - Offers MEMS design software tools and services to the semiconductor market
  • Nanostructured & Amorphous Materials Inc. - a major nano-scale powder supplier in the USA. Offer single-/multi- metal oxides, nitrides, carbides, Ti (C,N), rare earth oxides, diamond, carbon nanotubes, Si, semiconductor, metals, other with application to composite materials/polymers/plastics/coatings, catalysts, polishing media, bio-medical, pharmacy, microelectronic, chemical, mechanical, ceramic engineering. Also synthesize and process amorphous alloy powder and bulk metallic glasses to meet customer requirements.
  • Oxford Instruments Plasma Technology - Supplies plasma etchers (RIE, ICP), PECVD equipment, RF sputterers and ion beam equipment to the photonics and MEMS markets. Supports customers all over the world and have a license to sell the 'Bosch' deep silicon process
  • PhoeniX - PhoeniX develops software for Micro System Technology to provide the bridge between the design team and the real clean room environment. The software facilitates the communication from design into production and back. Re-usability, validation, and quality improvement of information, from research to volume production, are the key factors for efficient MST product development and reducing the design/production cycle. PhoeniX introduces unique software tools that facilitate First Time Right design (FTR) for various application areas, including Integrated Optics, Micro Mechanics and Nano technologies
  • SAMCO International, Inc. - Develops and manufactures a wide variety of unique deposition (PECVD), dry etching (RIE and ICP), and surface treatment systems (UV-Ozone Cleaners) for a worldwide network of major industrial customers and academic facilities. Provide process expertise and turnkey systems to major manufacturers in the compound semiconductor, optoelectronics, MEMS and other industries.
  • Surface Technology Systems plc - Manufacturer of cassette-to-cassette cluster and single/batch loadlocked plasma etch and deposition systems, that can be configured with ICP, RIE, XeF2 and PECVD sources. Products include the market-leading ASE? deep silicon etch process for MEMS/MOEMS micromachining. STS offers worldwide customer support through a network of international service centres and agents
  • Tanner Research, Inc. - provides design tools for IC, MEMS, and MCM applications
  • XACTIX - XACTIX is the leading supplier of xenon difluoride silicon etch equipment and etching services, providing an ideal solution for releasing MEMS and MOEMS devices. The XACTIX etch is an isotropic, highly selective, dry, gas phase etch, providing substantial benefits over wet or plasma etch processes
famousfab/start.txt · 最后更改: 2010/06/02 01:16 (外部编辑)